DAC
2012
ACM
13 years 13 days ago
2012
ACM
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
ICIP
2006
IEEE
15 years 11 months ago
2006
IEEE
This paper presents a new diffusion scheme on statistical manifolds for the detection of texture boundaries. The technique derives from our previous work, in which 2-dimensional R...