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    ASPDAC
    2012
    ACM
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    Design for manufacturability and reliability for TSV-based 3D ICs
    12 years 6 months ago
    Design for manufacturability and reliability for TSV-based 3D ICs
    Download  www.gtcad.gatech.edu
    —The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
    David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
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