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26
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ASPDAC
2006
ACM
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ASPDAC 2006
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A multi-technology-process reticle floorplanner and wafer dicing planner for multi-project wafers
14 years 4 months ago
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www.cecs.uci.edu
—As the VLSI manufacturing technology advances into the deep sub-micron(DSM) era, the mask cost can reach one or two million dollars. Multiple project wafers (MPW) which put diï¬...
Chien-Chang Chen, Wai-Kei Mak
claim paper
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