ICPP
2007
IEEE
14 years 5 months ago
2007
IEEE
Compute clusters are consuming more power at higher densities than ever before. This results in increased thermal dissipation, the need for powerful cooling systems, and ultimatel...
ICPP
2007
IEEE
14 years 5 months ago
2007
IEEE
The productivity of HPC system is determined not only by their performance, but also by their reliability. The conventional method to limit the impact of failures is checkpointing...
ICPP
2007
IEEE
14 years 5 months ago
2007
IEEE
ICPP
2007
IEEE
14 years 5 months ago
2007
IEEE
A self-organizing peer-to-peer system is built upon an application level overlay, whose topology is independent of underlying physical network. A well-routed message path in such ...
ICPP
2007
IEEE
14 years 5 months ago
2007
IEEE
We propose and evaluate a novel approach for automatic parallelization. The approach uses traces as units of parallel work. We discuss the benefits and challenges of the use of t...
ICPP
2007
IEEE
14 years 5 months ago
2007
IEEE
– Anonymous communication systems built on P2P infrastructures using anonymity forwarders are frequently affected by the churn problem, i.e. frequent joins and leaves of nodes. T...
ICPP
2007
IEEE
14 years 5 months ago
2007
IEEE
The demand for more computational power in science and engineering has spurred the design and deployment of ever-growing cluster systems. Even though the individual components use...
ICPP
2007
IEEE
14 years 5 months ago
2007
IEEE
—By combining an unstructured protocol with a DHT-based global index, hybrid peer-to-peer (P2P) improves search efficiency in terms of query recall and response time. The major c...
ICPP
2007
IEEE
14 years 5 months ago
2007
IEEE
Extension of battery lifetime has always been a major issue for mobile computing. While more and more data are involved in mobile computing, energy consumption caused by I/O opera...
ICPP
2007
IEEE
14 years 5 months ago
2007
IEEE
Three-dimensional Network-on-Chip (3-D NoC) is an emerging research topic exploring the network architecture of 3-D ICs that stack several smaller wafers for reducing wire length ...