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    2002
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    Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies
    14 years 10 months ago
    Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies
    Download  www.ee.cityu.edu.hk
    Gold to Gold Interconnection (GGI) flip chip bonding technology has been developed to bond the driver IC chip on the integrated circuit suspension used in hard disk drives (HDDs)....
    C. F. Luk, Y. C. Chan, K. C. Hung
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