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    CORR
    2007
    Springer
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    Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications
    14 years 2 months ago
    Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications
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    As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic Au-Sn alloy was used in this study. Using a coelectropla...
    Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seun...
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