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    DAC
    2007
    ACM
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    Placement of 3D ICs with Thermal and Interlayer Via Considerations
    15 years 14 days ago
    Placement of 3D ICs with Thermal and Interlayer Via Considerations
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    Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
    Brent Goplen, Sachin S. Sapatnekar
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