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    Flip-chip routing with unified area-I/O pad assignments for package-board co-design
    14 years 12 months ago
    Flip-chip routing with unified area-I/O pad assignments for package-board co-design
    Download  cc.ee.ntu.edu.tw
    In this paper, we present a novel flip-chip routing algorithm for package-board co-design. Unlike the previous works that can consider only either free- or pre-assignment routing,...
    Jia-Wei Fang, Martin D. F. Wong, Yao-Wen Chang
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