In this paper, we present a fast method for the detection of die extrusion defects in IC packages. The optical and lighting set-up as well as the details of the algorithm used for ...
With the proliferation of different types of IC packages, there is a need for machine-vision-based inspection systems to be able to efficiently identify the orientation of IC packa...
Automated Visual Inspection (AVI) is an essential part in the manufacturing process of Integrated Circuit (IC) packages. Contamination a common defect type found in IC packages ap...