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MVA
1998
110views Computer Vision» more  MVA 1998»
13 years 11 months ago
A fast algorithm for detecting die extrusion defects in IC packages
In this paper, we present a fast method for the detection of die extrusion defects in IC packages. The optical and lighting set-up as well as the details of the algorithm used for ...
H. Zhou, Ashraf A. Kassim, S. Ranganath
MVA
2000
152views Computer Vision» more  MVA 2000»
13 years 11 months ago
Automatic IC orientation checks
With the proliferation of different types of IC packages, there is a need for machine-vision-based inspection systems to be able to efficiently identify the orientation of IC packa...
Ashraf A. Kassim, H. Zhou, S. Ranganath
MVA
2007
146views Computer Vision» more  MVA 2007»
14 years 29 days ago
A SVM Based Method to Detect Color Shift Defects in IC Packages
Automated Visual Inspection (AVI) is an essential part in the manufacturing process of Integrated Circuit (IC) packages. Contamination a common defect type found in IC packages ap...
R. M. C. B. Ratnayake, Craig Hicks, M. A. Akbari