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    DAC
    2009
    ACM
    153views Computer Architecture» more  DAC 2009»
    Exploring serial vertical interconnects for 3D ICs
    15 years 13 days ago
    Exploring serial vertical interconnects for 3D ICs
    Download  www.engr.colostate.edu
    Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
    Sudeep Pasricha
    claim paper
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