This site uses cookies to deliver our services and to ensure you get the best experience. By continuing to use this site, you consent to our use of cookies and acknowledge that you have read and understand our Privacy Policy, Cookie Policy, and Terms
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequent...
This paper presents a layout generation tool that aims to reduce the gap between electrical sizing and physical realization of high performance analog circuits. The procedural lay...