ASPDAC
2011
ACM
13 years 3 months ago
2011
ACM
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequent...
ISQED
2000
IEEE
2000
IEEE
A Layout Approach for Electrical and Physical Design Integration of High-Performance Analog Circuits
14 years 3 months ago
This paper presents a layout generation tool that aims to reduce the gap between electrical sizing and physical realization of high performance analog circuits. The procedural lay...