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    ASPDAC
    2005
    ACM
    134views Hardware» more  ASPDAC 2005»
    Wire congestion and thermal aware 3D global placement
    14 years 5 months ago
    Wire congestion and thermal aware 3D global placement
    Download  www.gtcad.gatech.edu
    — The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
    Karthik Balakrishnan, Vidit Nanda, Siddharth Easwa...
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