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    GLVLSI
    2005
    IEEE
    120views VLSI» more  GLVLSI 2005»
    3D module placement for congestion and power noise reduction
    14 years 5 months ago
    3D module placement for congestion and power noise reduction
    Download  www.gtcad.gatech.edu
    3D packaging via System-On-Package (SOP) is a viable alternative to System-On-Chip (SOC) to meet the rigorous requirements of today’s mixed signal system integration. In this wo...
    Jacob R. Minz, Sung Kyu Lim, Cheng-Kok Koh
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