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TPDS
2010
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TPDS 2010
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Thermal-Aware Task Scheduling for 3D Multicore Processors
13 years 10 months ago
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www.cs.pitt.edu
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
Xiuyi Zhou, Jun Yang 0002, Yi Xu, Youtao Zhang, Ji...
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