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ICCAD
2006
IEEE
122views Hardware» more  ICCAD 2006»
14 years 8 months ago
Fill for shallow trench isolation CMP
Shallow trench isolation (STI) is the mainstream CMOS isolation technology. It uses chemical mechanical planarization (CMP) to remove excess of deposited oxide and attain a planar...
Andrew B. Kahng, Puneet Sharma, Alexander Zelikovs...