ASPDAC
2012
ACM
12 years 7 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
CISIS
2010
IEEE
14 years 4 months ago
2010
IEEE
Abstract—Program performance optimisations, feedbackdirected iterative compilation and auto-tuning systems [1] all assume a fixed estimation of execution time given a fixed inp...