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ASPDAC
2012
ACM
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12 years 6 months ago
Design for manufacturability and reliability for TSV-based 3D ICs
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
CISIS
2010
IEEE
14 years 4 months ago
Study of Variations of Native Program Execution Times on Multi-Core Architectures
Abstract—Program performance optimisations, feedbackdirected iterative compilation and auto-tuning systems [1] all assume a fixed estimation of execution time given a fixed inp...
Abdelhafid Mazouz, Sid Ahmed Ali Touati, Denis Bar...