—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
Abstract—Program performance optimisations, feedbackdirected iterative compilation and auto-tuning systems [1] all assume a fixed estimation of execution time given a fixed inp...
Abdelhafid Mazouz, Sid Ahmed Ali Touati, Denis Bar...