: New semiconductor wafer fabrication facilities use Front Opening Unified Pods (FOUPs) as a common unit of wafer transfer. Since the number of pods is limited due to high costs, a...
This paper focuses on a lot merging/splitting problem in a semiconductor wafer fabrication facility. In the fab, two or more lots can be merged into a single lot if routes and all...
June-Young Bang, Jae-Hun Kang, Bong-Kyun Kim, Yeon...
In this paper, multiple orders per job type formation and release strategies are described for semiconductor wafer fabrication facilities (wafer fabs). Different orders are groupe...
Jens Zimmermann, Scott J. Mason, John W. Fowler, L...
Semiconductor wafer fabrication facilities (wafer fabs) are among the most complex production facilities. A large product variety, hundreds of processing steps per product, hundre...