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    Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
    13 years 11 months ago
    Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
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    The development of a simplified analytical model to describe the thermal history of a Printed Circuit Board assembly (PCA) during convective reflow soldering is described in this ...
    Nele Van Steenberge, Paresh Limaye, Geert Willems,...
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