ETS
2010
IEEE
13 years 8 months ago
2010
IEEE
Testing of 3D stacked ICs (SICs) is becoming increasingly important in the semiconductor industry. In this paper, we address the problem of test architecture optimization for 3D s...
DAC
2007
ACM
14 years 8 months ago
2007
ACM
The test time for core-external interconnect shorts/opens is typically much less than that for core-internal logic. Therefore, prior work on test infrastructure design for core-ba...