Sciweavers
Explore
Publications
Books
Software
Tutorials
Presentations
Lectures Notes
Datasets
Labs
Conferences
Community
Upcoming
Conferences
Top Ranked Papers
Most Viewed Conferences
Conferences by Acronym
Conferences by Subject
Conferences by Year
Tools
Sci2ools
International Keyboard
Graphical Social Symbols
CSS3 Style Generator
OCR
Web Page to Image
Web Page to PDF
Merge PDF
Split PDF
Latex Equation Editor
Extract Images from PDF
Convert JPEG to PS
Convert Latex to Word
Convert Word to PDF
Image Converter
PDF Converter
Community
Sciweavers
About
Terms of Use
Privacy Policy
Cookies
45
click to vote
ETS
2010
IEEE
174
views
Hardware
»
more
ETS 2010
»
Test-architecture optimization for TSV-based 3D stacked ICs
14 years 18 days ago
Download
people.ee.duke.edu
Testing of 3D stacked ICs (SICs) is becoming increasingly important in the semiconductor industry. In this paper, we address the problem of test architecture optimization for 3D s...
Brandon Noia, Sandeep Kumar Goel, Krishnendu Chakr...
claim paper
Read More »