ASPDAC
2008
ACM
14 years 1 months ago
2008
ACM
: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
ISPD
2005
ACM
14 years 5 months ago
2005
ACM
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...