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    ISLPED
    2009
    ACM
    110views Hardware» more  ISLPED 2009»
    SOI, interconnect, package, and mainboard thermal characterization
    14 years 6 months ago
    SOI, interconnect, package, and mainboard thermal characterization
    Download  masc.soe.ucsc.edu
    This paper presents an evaluation to determine the importance of the accurate thermal characterization for several elements of a semiconductor device. Specifically, it evaluates ...
    Joseph Nayfach-Battilana, Jose Renau
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