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: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
This paper proposes the use of formal feedback control theory as a way to implement adaptive techniques in the processor architecture. Dynamic thermal management (DTM) is used as ...
Kevin Skadron, Tarek F. Abdelzaher, Mircea R. Stan