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ASPDAC
2006
ACM
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ASPDAC 2006
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Temperature-aware routing in 3D ICs
14 years 6 months ago
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www.ece.umn.edu
Three-dimensional integrated circuits (3D ICs) provide an attractive solution for improving circuit performance. Such solutions must be embedded in an electrothermally-conscious d...
Tianpei Zhang, Yong Zhan, Sachin S. Sapatnekar
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