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23
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CORR
2008
Springer
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CORR 2008
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Interconnect Challenges in Highly Integrated MEMS/ASIC Subsystems
14 years 20 hour ago
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hal.archives-ouvertes.fr
Micromechanical devices like accelerometers or rotation sensors form an increasing segment beneath the devices supplying the consumer market. A hybrid integration approach to buil...
N. Marenco, S. Warnat, W. Reinert
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