Sciweavers

FTEDA   2008
Wall of Fame | Most Viewed FTEDA-2008 Paper
FTEDA
2008
75views more  FTEDA 2008»
13 years 11 months ago
Thermally Aware Design
With greater integration, the power dissipation in integrated circuits has begun to outpace the ability of today's heat sinks to limit the on-chip temperature. As a result, t...
Yong Zhan, Sanjay V. Kumar, Sachin S. Sapatnekar
Disclaimer and Copyright Notice
Sciweavers respects the rights of all copyright holders and in this regard, authors are only allowed to share a link to their preprint paper on their own website. Every contribution is associated with a desciptive image. It is the sole responsibility of the authors to ensure that their posted image is not copyright infringing. This service is compliant with IEEE copyright.
IdReadViewsTitleStatus
1Download preprint from source75