With the advance of semiconductor manufacturing, There are many approaches to deal with these problems. EDA, and VLSI design technologies, circuits with even higher Adding discrete decoupling capacitors, embedding buried speed are integrated at an even higher density. Simultaneous decoupling capacitors, selecting the locations for the vias, switching noise (SSN) severely affects the performance of ICs and Etching trenches around the sensitive active devices and communication systems. In this paper, a novel multi-via employing differential interconnects are considered to be electromagnetic bandgap (MV-EBG) structure is proposed with alternatives for SSN suppression [3]. However, insufficienciessuper-wideband SSN suppression. The stopband of the proposed exist in these methods [4]-[6]. Most recently, a novel conceptMV-EBG structure is much wider than the traditional one, about 2 to 6 times. Little extra cost is added since there is no more of mitigating SSN noise using electromagnetic ba...