Design And Fabrication of Condenser Microphone Using Wafer Transfer And Micro-electroplating Technique

A novel fabrication process, which uses wafer transfer and micro-electroplating technique, has been proposed and tested. In this paper, the effects of the diaphragm thickness and stress, the air-gap thickness, and the area ratio of acoustic holes to backplate on the sensitivity of the condenser microphone have been demonstrated since the performance of the microphone depends on these parameters. The microphone diaphragm has been

• Type: Journal
• Year: 2008
• Where: CORR
• Authors: Zhen-Zhun Shu, Ming-Li Ke, Guan-Wei Chen, Ray Hua Horng, Chao-Chih Chang, Jean-Yih Tsai, Chung-Ching Lai, Ji-Liang Chen
• Keywords: Air-gap Thickness, CORR 2008, Diaphragm Thickness, Education, Microphone