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ICCAD
2006
IEEE

Stable and compact inductance modeling of 3-D interconnect structures

14 years 8 months ago
Stable and compact inductance modeling of 3-D interconnect structures
Recent successful techniques for the efficient simulation of largescale interconnect models rely on the sparsification of the inverse of the inductance matrix L. While there are several techniques for sparsifying L−1, the stability of these approximations for general interconnect structures has not been established, i.e., the sparsified reluctance and inductance matrices are not guaranteed to be positive-definite. In this paper, we present a novel technique for reluctance sparsification for general interconnect structures that enjoys several advantages: First, the resulting sparse approximation is guaranteed to be positive definite. Second, the approximation is optimal, in a certain well-defined sense. Third, owing to its computational efficiency and numerical stability, the algorithm is applicable for very large problem sizes. Finally our approach yields a compact representation of both inductance and reluctance matrices for general cases.
Hong Li, Venkataramanan Balakrishnan, Cheng-Kok Ko
Added 16 Mar 2010
Updated 16 Mar 2010
Type Conference
Year 2006
Where ICCAD
Authors Hong Li, Venkataramanan Balakrishnan, Cheng-Kok Koh
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