3-D Thermal-ADI: a linear-time chip level transient thermal simulator

13 years 11 months ago

Abstract--Recent study shows that the nonuniform thermal distribution not only has an impact on the substrate but also interconnects. Hence, three

Ting-Yuan Wang, Charlie Chung-Ping Chen

Efficient 3-D Transient | Nonuniform Thermal Distribution | TCAD 2002 | Thermal |

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Added	23 Dec 2010
Updated	23 Dec 2010
Type	Journal
Year	2002
Where	TCAD
Authors	Ting-Yuan Wang, Charlie Chung-Ping Chen

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