The instruction cache has been recognized as one of the least hot units in microprocessors, which leaves the instruction cache largely ignored in onchip thermal management. Consequ...
Joonho Kong, Johnsy K. John, Eui-Young Chung, Sung...
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
Thermal management is critical for clusters because of the increasing power consumption of modern processors, compact server architectures and growing server density in data center...
—while dealing with sub-micrometer precision robots, thermal expansion is the most significant source of inaccuracy. Thermal variations in the environment, in the robot parts a...
Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
Amit Kumar 0002, Li Shang, Li-Shiuan Peh, Niraj K....
Abstract-- Preventing silicon chips from negative, even disastrous thermal hazards has become increasingly challenging these days; considering thermal effects early in the design c...
Wei Huang, Karthik Sankaranarayanan, Kevin Skadron...
In this paper we present a technique for fusion of optical and thermal face images based on image pixel fusion approach. Out of several factors, which affect face recognition perfo...
Mrinal Kanti Bhowmik, Debotosh Bhattacharjee, Mita...
Thermal monitoring of a design plays a vital role to ensure safe and reliable thermal operating conditions. Thermal monitoring by employing thermal sensors is a popular technique ...
Rajarshi Mukherjee, Somsubhra Mondal, Seda Ogrenci...