| A 3D prototyping chip based on a wafer-level stacking technology Recent countries visiting this post |  |
 | 4 | United States |
 | 1 | Germany |
 | 1 | Russian Federation |
| A 3D prototyping chip based on a wafer-level stacking technology Recent countries visiting this post | |
| 4 | United States |
| 1 | Germany |
| 1 | Russian Federation |