| Active Device under Bond Pad to Save I/O Layout for High-pin-count SOC Recent countries visiting this post |  |
 | 11 | United States |
 | 7 | |
 | 1 | India |
 | 1 | Malaysia |
| Active Device under Bond Pad to Save I/O Layout for High-pin-count SOC Recent countries visiting this post | |
| 11 | United States |
| 7 | |
| 1 | India |
| 1 | Malaysia |