Adaptive multi-domain thermal modeling and analysis for integrated circuit synthesis and design

Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC thermal analysis suffer performance or accuracy problems that prevent use in IC synthesis and hinder use in architectural design. This article describes ISAC, a novel, fast, accurate thermal analysis system for use in IC synthesis and design. We present new, cooperative, temporal and spatial adaptation methods to dramatically accelerate accurate analysis. The proposed system unifies steady-state, time-domain, and frequency-domain analysis techniques. It is composed of our spatiallyadaptive multigrid iterative solver, a new temporally and spatially adaptive asynchronous time marching solver, and a new spatially-adaptive frequency-domain moment matching solver. Together, these cooperative adaptation and multi-domain analysis techniques allow the proposed system to efficiently solve the static, short time scal...

• Type: Conference
• Year: 2006
• Where: ICCAD
• Authors: Yonghong Yang, Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert P. Dick
• Keywords: Accurate Thermal Analysis, Hardware, IC Thermal Analysis, ICCAD 2006, Thermal Analysis Problem