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41
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ICCAD
2006
IEEE
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ICCAD 2006
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Adaptive multi-domain thermal modeling and analysis for integrated circuit synthesis and design
14 years 9 months ago
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www.cecs.uci.edu
Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
Yonghong Yang, Changyun Zhu, Zhenyu (Peter) Gu, Li...
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