Analysis of Non-Uniform Temperature-Dependent Interconnect Performance in High Performance ICs

Non-uniform temperature profiles along global interconnect lines in high-performance ICs can significantly impact the performance of these lines. This paper presents a detailed analysis and modeling of the interconnect performance degradation due to non-uniform temperature profiles that exist along their lengths, which in turn arise due to the thermal gradients in the underlying substrate. A nonuniform temperature-dependent distributed RC interconnect delay model is proposed for the first time. The model has been applied to a wide variety of interconnect layouts and temperature distributions to quantify the impact on signal integrity issues including clock skew fluctuations.

• Type: Conference
• Year: 2001
• Where: DAC
• Authors: Amir H. Ajami, Kaustav Banerjee, Massoud Pedram, Lukas P. P. P. van Ginneken
• Keywords: DAC 2001, Design Automation, Interconnect Delay Model, Interconnect Performance Degradation, Non-uniform Temperature Profiles