A Comparative Study on Dicing of Multiple Project Wafers

This paper carries out a comparative study on the methods of dicing multi-project wafers (MPW). Our dicing method results in using 40% fewer wafers both for low and high volume production.

• Type: Conference
• Year: 2005
• Where: ISVLSI
• Authors: Meng-Chiou Wu, Rung-Bin Lin
• Keywords: Fewer Wafers, ISVLSI 2005, Multi-project Wafers