Double-via-driven standard cell library design

Double-via placement is important for increasing chip manufacturing yield. Commercial tools and recent work have done a great job for it. However, they are found with a limited capability of placing more double vias (called via1) between metal 1 and metal 2. Such a limitation is caused by the way we design the standard cells and can not be resolved by developing better tools. This paper presents a double-via-driven standard cell library design approach to solving this problem. Compared to the results obtained using a commercial cell library, our library on average achieves 78% reduction in dead vias and 95% reduction in dead via1s at the expense of 11% increase in total via count. We achieve these results (almost) at no extra cost in total cell area and wire length.

• Type: Conference
• Year: 2007
• Where: DATE
• Authors: Tsai-Ying Lin, Tsung-Han Lin, Hui-Hsiang Tung, Rung-Bin Lin
• Keywords: Cell Library, Chip Manufacturing Yield, DATE 2007, Hardware, Standard Cell