| Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling Recent countries visiting this post |  |
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| Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling Recent countries visiting this post | |
| 7 | United States |
| 5 | |
| 4 | France |
| 1 | Russian Federation |
| 1 | China |