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    High-temperature reliability of Flip Chip assemblies

    14 years 11 days ago
    High-temperature reliability of Flip Chip assemblies
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    T. Braun, K.-F. Becker, M. Koch, V. Bader, Rolf As
    claim paper
    Added 14 Dec 2010
    Updated 14 Dec 2010
    Type Journal
    Year 2006
    Where MR
    Authors T. Braun, K.-F. Becker, M. Koch, V. Bader, Rolf Aschenbrenner, Herbert Reichl
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