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    MR
    2008
    94views Robotics» more  MR 2008»
    Stress intensities at the triple junction of a multilevel thin film package
    14 years 7 days ago
    Stress intensities at the triple junction of a multilevel thin film package
    Download  altair.chonnam.ac.kr
    Stress intensities of a singular near-tip field around the vertex of a triple junction wedge in multilevel thin film packages are calculated using the two-state M-integral. For th...
    Insu Jeon, Ki-Ju Kang, Seyoung Im
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    MR
    2008
    86views Robotics» more  MR 2008»
    Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organ
    14 years 7 days ago
    Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organ
    Download  npil.kaist.ac.kr
    The effects of bonding temperatures on the composite properties and reliability performances of anisotropic conductive films (ACFs) for flip chip on organic substrates assemblies ...
    J. S. Hwang, M. J. Yim, K. W. Paik
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    MR
    2008
    88views Robotics» more  MR 2008»
    Characterization of semiconductor interfaces using a modified mixed mode bending apparatus
    14 years 7 days ago
    Characterization of semiconductor interfaces using a modified mixed mode bending apparatus
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    This research deals with the experimental assessment of the strength of bi-material interfaces as a function of mode mixity, focusing on two dimensional problems. A modified mixed...
    J. Thijsse, Olaf van der Sluis, J. A. W. van Domme...
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    MR
    2006
    114views Robotics» more  MR 2006»
    CCGA packages for space applications
    14 years 21 days ago
    CCGA packages for space applications
    Download  nepp.nasa.gov
    Commercial-off-the-shelf (COTS) area array packaging technologies in high reliability versions are now being considered for applications, including use in a number of NASA electro...
    Reza Ghaffarian
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    MR
    2006
    100views Robotics» more  MR 2006»
    ESD robustness of thin-film devices with different layout structures in LTPS technology
    14 years 21 days ago
    ESD robustness of thin-film devices with different layout structures in LTPS technology
    Download  www.ics.ee.nctu.edu.tw
    The electrostatic discharge (ESD) robustness of different thin-film devices, including three diodes and two thin-film transistors (TFTs) in low-temperature polysilicon (LTPS) tech...
    Chih-Kang Deng, Ming-Dou Ker
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    MR
    2006
    108views Robotics» more  MR 2006»
    Electronic circuit reliability modeling
    14 years 21 days ago
    Electronic circuit reliability modeling
    Download  www.eng.tau.ac.il
    The intrinsic failure mechanisms and reliability models of state-of-the-art MOSFETs are reviewed. The simulation tools and failure equivalent circuits are described. The review in...
    Joseph B. Bernstein, Moshe Gurfinkel, Xiaojun Li, ...
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    MR
    2006
    73views Robotics» more  MR 2006»
    Reduced temperature dependence of hot carrier degradation in deuterated nMOSFETs
    14 years 21 days ago
    Reduced temperature dependence of hot carrier degradation in deuterated nMOSFETs
    Download  sc.el.utwente.nl
    Deuterated oxides exhibit prolonged hot carrier lifetimes at room temperature. We report evidence that this improved hot carrier hardness exists over the temperature range between...
    Cora Salm, André J. Hof, Fred G. Kuper, Jur...
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    MR
    2006
    75views Robotics» more  MR 2006»
    New experimental findings on hot-carrier-induced degradation in lateral DMOS transistors
    14 years 21 days ago
    New experimental findings on hot-carrier-induced degradation in lateral DMOS transistors
    Download  sdtlab.incheon.ac.kr
    In Kyung Lee, Se Re Na Yun, Kyosun Kim, Chong-Gun ...
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    MR
    2006
    58views Robotics» more  MR 2006»
    Drop impact reliability testing for lead-free and lead-based soldered IC packages
    14 years 21 days ago
    Drop impact reliability testing for lead-free and lead-based soldered IC packages
    Download  www.utacgroup.com
    Board-level drop impact testing is a useful way to characterize the drop durability of the different soldered assemblies onto the printed circuit board (PCB). The characterization...
    Desmond Y. R. Chong, F. X. Che, John H. L. Pang, K...
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    MR
    2006
    73views Robotics» more  MR 2006»
    Reliability of large periphery GaN-on-Si HFETs
    14 years 21 days ago
    Reliability of large periphery GaN-on-Si HFETs
    Download  www.nitronex.com
    S. Singhal, T. Li, A. Chaudhari, A. W. Hanson, R. ...
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