Sciweavers

MR
2008
94views Robotics» more  MR 2008»
13 years 11 months ago
Stress intensities at the triple junction of a multilevel thin film package
Stress intensities of a singular near-tip field around the vertex of a triple junction wedge in multilevel thin film packages are calculated using the two-state M-integral. For th...
Insu Jeon, Ki-Ju Kang, Seyoung Im
MR
2008
86views Robotics» more  MR 2008»
13 years 11 months ago
Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organ
The effects of bonding temperatures on the composite properties and reliability performances of anisotropic conductive films (ACFs) for flip chip on organic substrates assemblies ...
J. S. Hwang, M. J. Yim, K. W. Paik
MR
2008
88views Robotics» more  MR 2008»
13 years 11 months ago
Characterization of semiconductor interfaces using a modified mixed mode bending apparatus
This research deals with the experimental assessment of the strength of bi-material interfaces as a function of mode mixity, focusing on two dimensional problems. A modified mixed...
J. Thijsse, Olaf van der Sluis, J. A. W. van Domme...
MR
2006
114views Robotics» more  MR 2006»
13 years 11 months ago
CCGA packages for space applications
Commercial-off-the-shelf (COTS) area array packaging technologies in high reliability versions are now being considered for applications, including use in a number of NASA electro...
Reza Ghaffarian
MR
2006
100views Robotics» more  MR 2006»
13 years 11 months ago
ESD robustness of thin-film devices with different layout structures in LTPS technology
The electrostatic discharge (ESD) robustness of different thin-film devices, including three diodes and two thin-film transistors (TFTs) in low-temperature polysilicon (LTPS) tech...
Chih-Kang Deng, Ming-Dou Ker
MR
2006
108views Robotics» more  MR 2006»
13 years 11 months ago
Electronic circuit reliability modeling
The intrinsic failure mechanisms and reliability models of state-of-the-art MOSFETs are reviewed. The simulation tools and failure equivalent circuits are described. The review in...
Joseph B. Bernstein, Moshe Gurfinkel, Xiaojun Li, ...
MR
2006
73views Robotics» more  MR 2006»
13 years 11 months ago
Reduced temperature dependence of hot carrier degradation in deuterated nMOSFETs
Deuterated oxides exhibit prolonged hot carrier lifetimes at room temperature. We report evidence that this improved hot carrier hardness exists over the temperature range between...
Cora Salm, André J. Hof, Fred G. Kuper, Jur...
MR
2006
58views Robotics» more  MR 2006»
13 years 11 months ago
Drop impact reliability testing for lead-free and lead-based soldered IC packages
Board-level drop impact testing is a useful way to characterize the drop durability of the different soldered assemblies onto the printed circuit board (PCB). The characterization...
Desmond Y. R. Chong, F. X. Che, John H. L. Pang, K...
MR
2006
73views Robotics» more  MR 2006»
13 years 11 months ago
Reliability of large periphery GaN-on-Si HFETs
S. Singhal, T. Li, A. Chaudhari, A. W. Hanson, R. ...