MEMS Fabrication

This summary of selected microelectromechanical systems (MEMS) processes guides the reader through a wide variety of fabrication techniques used to make micromechanical structures. Process flows include wet bulk etching and wafer bonding, surface micromachining, deep trench silicon micromachining, CMOS MEMS, and micromolding.

• Type: Conference
• Year: 2003
• Where: ITC
• Authors: Gary K. Fedder
• Keywords: CMOS MEMS, Deep Trench Silicon, Hardware, ITC 2003, Surface Micromachining