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    ACM
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    A multilevel analytical placement for 3D ICs

    14 years 7 months ago
    A multilevel analytical placement for 3D ICs
    Download  cadlab.cs.ucla.edu
    Jason Cong, Guojie Luo
    claim paper
    Added 28 May 2010
    Updated 28 May 2010
    Type Conference
    Year 2009
    Where ASPDAC
    Authors Jason Cong, Guojie Luo
    Comments (0)
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