Software system for semiconductor devices, monolith and hybrid ICs thermal analysis

A three level software system for thermal analysis of semiconductor devices, one-chip monolith IC's, multi-chip modules (MCM) and hybrid IC's is presented. For each design level the 3D temperature simulators are described to analyze the steady state and transient thermal behavior and connect the design results with the device and/or IC layout and packaging constructions. Practical examples are discussed illustrating the possibilities of developed techniques and software tools.

• Type: Conference
• Year: 1995
• Where: EURODAC
• Authors: Konstantin O. Petrosjanc, I. A. Kharitonov, N. I. Rybov, Peter P. Maltcev
• Keywords: EURODAC 1995, IC Layout, Multi-chip Modules, Transient Thermal Behavior, VHDL