| A study of Through-Silicon-Via impact on the 3D stacked IC layout Recent countries visiting this post |  |
 | 7 | United States |
 | 5 | Taiwan |
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| A study of Through-Silicon-Via impact on the 3D stacked IC layout Recent countries visiting this post | |
| 7 | United States |
| 5 | Taiwan |
| 2 | Russian Federation |
| 1 | Germany |
| 1 | |
| 1 | Japan |