Taiwan foundry for system-in-package (SIP)

-- System-In-Package (SIP) is a cost-effective alternative to System-On-Chip (SOC) and chips with embedded memory. The key elements of SIP technology include I/O redistribution, solder bumping, flip chip assembly, and high density thin film interconnect substrate with/without integrated passives. To meet the need of SIP, as well as other advanced packaging solutions, APack Technologies has been set up to serve worldwide customers. High quality of the APack’s service is built upon the SIP technology licensed from Bell Labs of Lucent Technologies, and the experience of cost competitive wafer fabrication of foundries in Taiwan.

• Type: Conference
• Year: 2000
• Where: ASPDAC
• Authors: Albert Lin
• Keywords: ASPDAC 2000, Flip Chip Assembly, Hardware, SIP Technology, Technology Include I/o