Through Silicon Vias as Enablers for 3D Systems

13 years 11 months ago

This special session on 3D TSV

E. Jung, Andreas Ostmann, Peter Ramm, Jürgen

Active Circuit | CORR 2008 | Education | Potential Implementation Solutions | Special Session |

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Added	09 Dec 2010
Updated	09 Dec 2010
Type	Journal
Year	2008
Where	CORR
Authors	E. Jung, Andreas Ostmann, Peter Ramm, Jürgen Wolf, Michael Toepper, Maik Wiemer

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