9152 search results - page 116 / 1831 » 3D or not 3D |
ICCAD
2007
IEEE
14 years 6 months ago
2007
IEEE
— In this paper, we present the first work on the Steiner routing for 3D stacked ICs. In the 3D Steiner routing problem, the pins are located in multiple device layers, which ma...
ISMAR
2009
IEEE
14 years 3 months ago
2009
IEEE
: In this paper, we present a mobile augmented reality application that is based on the acquisition of user-generated content obtained by 3D snapshotting. To take a 3D snapshot of ...
ICMCS
2008
IEEE
14 years 3 months ago
2008
IEEE
– Nowadays, the Internet provides a convenient medium for sharing complex 3D models online. However, transmitting 3D progressive meshes over networks may encounter the problem of...
GMP
2010
IEEE
14 years 1 months ago
2010
IEEE
The Voronoi diagram is a fundamental geometry structure widely used in various fields, especially in computer graphics and geometry computing. For a set of points in a compact 3D d...
TCAD
2011
13 years 4 months ago
2011
—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...