9152 search results - page 133 / 1831 » 3D or not 3D |
ATAL
2005
Springer
14 years 2 months ago
2005
Springer
In this paper we propose the use of 3D Virtual Worlds for the visualization of Electronic Institutions. We show how 3D representation helps to open Electronic Institutions to huma...
DIGITALCITIES
2001
Springer
14 years 1 months ago
2001
Springer
This paper proposes a new style tool, a 3-D photo collage system, to manage new style of digital cities. This system allows ordinary people to create, publish, share and navigate p...
HPCA
2009
IEEE
14 years 10 months ago
2009
IEEE
Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and hi...
SMI
2005
IEEE
14 years 2 months ago
2005
IEEE
We present a 3D matching framework based on a many-to-many matching algorithm that works with skeletal representations of 3D volumetric objects. We demonstrate the performance of ...
ICCD
2004
IEEE
14 years 6 months ago
2004
IEEE
This short paper explores an implementation of a new technology called 3D die stacking and describes research activity at Intel. 3D die stacking is the bonding of two die either f...