9152 search results - page 74 / 1831 » 3D or not 3D |
DCC
2007
IEEE
14 years 3 months ago
2007
IEEE
: The paper proposes a lossy compression mechanism for 3D models (3D meshes) by improving existing compression mechanism such as progressive meshes and single refinement mesh compr...
ECCV
2008
Springer
14 years 11 months ago
2008
Springer
Facial expression modeling is central to facial expression recognition and expression synthesis for facial animation. Previous works reported that modeling the facial expression wi...
ICDE
2004
IEEE
14 years 10 months ago
2004
IEEE
In this paper, we will look at substructure clustering of sequential 3d objects. A sequential 3d object is a set of points located in a three dimensional space that are linked up ...
AVBPA
2005
Springer
14 years 2 months ago
2005
Springer
Pose and illumination changes from picture to picture are two main barriers toward full automatic face recognition. In this paper, a novel method to handle both pose and lighting c...
NOCS
2010
IEEE
13 years 7 months ago
2010
IEEE
—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...